An ultra-thin continuous-fiber thermoplastic tape engineered for heat dissipation. Through-thickness thermal conductivity reaches 5 W/(m·K), giving structural laminates a thermal-management function that ordinary composites cannot provide. The tape is available on TPI, PEEK, and PA6 matrices and supports both in-situ laser consolidation and hot molding — so the same tape that stiffens a component can also spread its heat.
Key Features
Specifications
| Parameter | Specification |
|---|---|
| Through-Thickness Thermal Conductivity | Up to 5 W/(m·K) |
| Thickness | 0.07 – 0.20 mm |
| Tape Width | 1 – 30 mm |
| Resin Weight Fraction | 25 – 40% |
| Matrix Systems | TPI / PEEK / PA6 |
| Processing | In-situ laser consolidation, hot molding |
| Target Use | 3C electronics thermal management |
* Data shown are typical values. Custom specifications available upon request.
Applications
3C electronics — laptop and tablet heat-spreading shells, smartphone back covers, wearable housings
Energy storage modules and battery thermal management
Industrial equipment requiring structural heat dissipation
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