Continuous fiber reinforced thermoplastic solid panel manufactured by hot-press laminating stacked unidirectional tapes.
Key Features
Specifications
| Parameter | Specification |
|---|---|
| Fiber Content Range | 50% - 70% |
| Width Range | <= 3200 mm |
| Thickness Range | 0.5 - 6 mm |
| Roll Length | 250 m / 500 m / OEM |
| Tape Structure | 0/90, 0/90/0, 0/90/90/0 |
| Face Material | UV film, PET film, Nonwoven, Alu foil, PVC |
| Colour Options | Natural, Black, OEM |
| Custom Requirements | Antislip, Flame-retardant, Anti-aging |
* Data shown are typical values. Custom specifications available upon request.
Applications
Premium kitchen cabinetry
Automotive interiors
Structural components
Related Products
CF/PEEK UD Tape 0.07mm
Continuous carbon fiber pre-impregnated with PEEK (polyether ether ketone) in an ultra-thin unidirectional tape. At 0.07–0.20 mm, the tape supports rapid thermoplastic processing — laser-assisted in-situ consolidation, automated tape laying, and hot stamping — replacing autoclave cycles measured in hours with molding cycles measured in seconds to minutes. PEEK matrix gives outstanding toughness with superior impact, delamination, and fatigue resistance. The tape is weldable, repairable, and 100% recyclable.
View Details
CF/TPI UD Tape 260°C
Continuous carbon fiber tape pre-impregnated with thermoplastic polyimide (TPI), engineered by a proprietary suspension-melt combined prepreg process. The tape sustains long-term service at 260°C, exhibits a near-zero coefficient of thermal expansion, and withstands space radiation — a combination built for aerospace structures that face thermal cycling and vacuum exposure. Like all Zloonex CFRTP tapes, it is weldable, repairable, and 100% recyclable.
View Details
Thermal Conductive Tape 5W/mK
An ultra-thin continuous-fiber thermoplastic tape engineered for heat dissipation. Through-thickness thermal conductivity reaches 5 W/(m·K), giving structural laminates a thermal-management function that ordinary composites cannot provide. The tape is available on TPI, PEEK, and PA6 matrices and supports both in-situ laser consolidation and hot molding.
View Details